Method of making wood-based composite board
US6702969B2 · kind B2 · utility
13Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jan 28, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249925
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wood composite board or panel, such as particleboard, fiberboard, oriented strand board or waferboard and a method of producing the same. The composite board or panel comprises a plurality of wood pieces, thermoset resin to bind the wood pieces and a filler having a high thermal conductivity. Examples of such a filler include natural and synthetic graphites, metal, carbon, silicon carbide and other similar compounds and their mixtures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.