Semiconductor device and manufacturing the same
US6703261B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jan 28, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive. The semiconductor device comprises a heat sink, a pair of screwing pieces having respective inner end portions connected to both ends of the heat sink and further having outer end portions respectively formed with through spaces for screwing, one or more semiconductor chips fixed to a main surface of the heat sink, a seal member formed of an insulating resin which covers a back side of the heat sink and also covers the other portions of the paired screwing pieces than the outer end portions, a first lead having an outer end portion projecting from the seal member and further having an inner end portion which is positioned within the seal member and whose inner end is arranged near one side face of the heat sink, a second lead having an outer end portion projecting from the seal member and further having an inner end portion positioned within the seal member and near another side face of the heat sink, and plural conductive wires for electrically connecting between the leads and predetermined electrodes of a predetermined semiconductor chip, or between the leads and predetermined …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.