Thermal recording material
US6703344B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Sep 28, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/3372
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention provides a thermal recording material comprising a support and at least one thermal recording layer disposed on the support, wherein the layer comprises at least one electron-accepting compound, and microcapsules, which encapsulate an electron-donating dye precurser and are formed using a compound represented by the following general formula (I) and a compound represented by the following general formula Formula (II): wherein each of R1 and R2 represents an alkyl group; n is an integer selected from 0 to 3; and M represents Na, Mg, K or Ca.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.