Adhesives and sealants
US6703467B1 · kind B1 · utility
1Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jan 3, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07F7/1804
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
An adhesive or sealant composition comprising a compound of formula (I) provided that at least one of (a) R1 and R6 or (b) R2 and R3 or (c) R4 and R5 includes an electron withdrawing group; and where necessary, a polymerization initiator. Novel compounds of formula (I) are also described and claimed. Adhesive compositions can be used to bond for example glass and metal surfaces. Certain biocompatible adhesives for medical applications are included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.