Header assembly having integrated cooling device
US6703561B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Aug 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.