Compact, thermally stabilized housing for planar lightguide circuits
US6703588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A housing is provided for maintaining a planar lightguide circuit at a temperature within a predetermined temperature range independent of ambient temperature. The housing includes a planar heating arrangement supporting and in thermal contact with the planar lightguide circuit. Also included is a frame assembly having a first surface on which the planar heating arrangement is fixed. The frame assembly has at least one opening through which extends at least one optical fiber coupled to the planar lightguide circuit. An overmold, which is molded around the frame assembly, includes at least one strain relief member through which the optical fiber extends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.