IC chip mounting structure and display device
US6703702B2 · kind B2 · utility
44Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.