Semiconductor device and method for packaging same
US6703705B2 · kind B2 · utility
15Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Apr 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.