Bonder chuck and optical component mounting structure interface
US6704150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jun 10, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
12 of 12 An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.