Assembly device and method for assembling an electronic component

US6704206B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Norbert Martin · Ottersweier, DE
• Christoph Ruf · Eningen unter Achalm, DE

Key dates

• Filing date: Apr 10, 2002
• Grant date: Mar 9, 2004
• Expiry date: Apr 10, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67121
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate. Using the assembly device, the two circuit substrates may be simply adjusted with respect to each other during assembly of the electronic component. For this, the assembly device includes a first lower shell including an accommodation for the first of the two circuit substrates, an arrangement for the defined alignment of the first circuit substrate in the accommodation, and a second, upper shell including an arrangement for adjusting the second circuit substrate positioned on the semiconductor element. A method for assembling an electronic component in sandwich type of construction, using such an assembly device, is also described.