Fiber optic interface module and associated fabrication method
US6704515B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1999 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Dec 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2012/4028
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
More cost-effective fiber optic interface modules, such as fiber optic transmitter modules and fiber optic receiver modules, are provided that meet the high performance requirements demanded by avionics and other specialized applications over a wide range of temperatures and other environmental conditions. The fiber optic interface module includes a printed wiring board having a pair of outwardly extending arms that define a notch therebetween. The fiber optic interface module also includes an integrated circuit mounted upon a medial portion of the printed wiring board and an optical subassembly. The optical subassembly includes a receptacle and an optoelectronic device, such as a light source or a detector. The receptacle generally defines an internal cavity for receiving the optoelectronic device and a pair of slots proximate the internal cavity. As such, the transmitter optical subassembly can be mounted to the printed wiring board so as to be at least partially disposed in the notch defined by the printed wiring board. In this regard, the respective arm portions of the printed wiring board are preferably inserted into the pair of slots defined by the receptacle in order to perm…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.