Two stage cooling system employing thermoelectric modules
US6705089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Apr 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.