Apparatus for forming polymer continuously on the surface of metal by DC plasma polymerization
US6705245B1 · kind B1 · utility
7Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2000 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Aug 18, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2252/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to an apparatus for forming polymer by DC plasma polymerization wherein a substrate is used as an electrode by applying a power to the substrate and an opposite electrode in a deposition chamber is positioned to both the surfaces of the substrate to be deposited. In addition, the present invention can acquire safety during the polymerization by insulating a main body from a substrate to which voltage is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.