Substrate for fluid ejection devices
US6705705B2 · kind B2 · utility
12Cited by
20References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.