Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using
US6705923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Apr 25, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polisher that is equipped with a chilled wafer holder and a chilled polishing pad and a method for operating the chemical mechanical polisher are described. A first heat exchanging fluid is flown into a membrane chamber inside the wafer holder in intimate contact with the backside of the wafer such that the wafer can be sufficiently cooled. A second heat exchanging fluid is circulated in a plurality of surface grooves, or fluid channels provided in the bottom surface of the polishing pad to sufficiently cool the polishing pad during a chemical mechanical polishing process. The slurry suspension contained in-between the wafer surface and the polishing pad can thus be sufficiently cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.