Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
US6705925B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C1/045
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method to cut irregularly shaped dice from a wafer using a fluid jet cutting system. One embodiment of the invention involves a method to cut irregularly shaped dice from a wafer, such as planar light-wave circuit device. The method includes placing a wafer on a fixture; aligning the wafer in the fixture to expose the dice to a fluid jet cutting nozzle; supplying an abrasive to the fluid jet cutting nozzle; supplying a pressurized fluid to the fluid jet cutting nozzle expelling the abrasive in combination with the fluid from the fluid jet cutting nozzle at a velocity sufficient to cut through the wafer, while the fluid jet cutting nozzle moves in relation to the wafer in the fixture; and removing the dice from the fixture after the dice have been cut from the wafer. A second embodiment of the invention is directed to an apparatus to provide a wafer die cutting system to cut a wafer. The apparatus includes a fixture to align and hold the wafer; a cutting nozzle to expel a fluid and an abrasive towards the wafer at a velocity sufficient to cut through the wafer; a fluid source to supply the fluid to the cutting nozzle; an abrasive source to supply the abrasive to the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.