Abrasive molding and abrasive disc provided with same
US6705935B2 · kind B2 · utility
2Cited by
5References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | May 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive molding composed of a mass of inorganic particles, said mass having pores intervening among the inorganic particles, which molding has abrasive area to be placed in frictional contact with an article to be abraded, and non-abrasive area on a abrading surface of the abrasive molding. The abrasive area has exposed pores having a diameter of not larger than 1 &mgr;m, the total area of said exposed pores having a diameter of not larger than 1 &mgr;m occupying below 15% of the total area of abrasive area, and the non-abrasive area occupies 20% to 60% of the sum of the abrasive area and the non-abrasive area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.