Patent · US Expired

Device and method for the treatment of semiconductor wafers

US6706121B2 · kind B2 · utility

0Cited by

6References

14Claims

0Family size

Assignee

Mattson Wet Products · DE

Inventors

Manfred Schenkl · Tübingen, DE
Robert S. Pesce · Woburn, US
John Oshinowo · Villingen-Schwenningen, DE
Uwe Muller · Linz, AT

Key dates

Filing date	Oct 23, 2002
Grant date	Mar 16, 2004
Priority date	—
Expiry date	Oct 23, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/906
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before receiving another treatment fluid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.