Patent · US Expired

Method for producing metallized substrate materials

US6706201B1 · kind B1 · utility

5Cited by

4References

9Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heinrich Meyer · Berlin, DE
Ralf Schulz · Speyer, DE
Roland Heinz · Northeim, DE
Eckart Klusmann · Troisdorf, DE

Key dates

Filing date	Dec 21, 2000
Grant date	Mar 16, 2004
Priority date	—
Expiry date	Dec 21, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH05K1/034
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.