Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
US6706316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Dec 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8722
Abstract
A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device including depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical conductor; providing a low melting point indium metal or alloy in the form of a wire having diameter ranging from 1 mil to 10 mils on the electrically insulating thin layer on the substrate so that the wire is situated around the periphery of the electronic device; placing an ultrasonic horn over the cover plate so that ultrasonic energy can be delivered through the cover plate to the wire and applying a pressure between 20 and 100 psi; and providing an acoustic wave to melt the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.