Method of making a micromechanical device
US6706548B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Jan 25, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0006
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of making a micromechanical device including forming recesses (28) using two sacrificial layers (22 and 27). A first sacrificial layer (22) is formed over an input signal line (16) and an output signal line (17). A portion of the first sacrificial layer (22) is removed to form openings (26) over the input signal line (16) and the output signal line (17). A second sacrificial layer (27) is formed over the first sacrificial layer (22) and openings (26) to form recesses (28) over the openings (26). A conductive layer (32) is formed over the second sacrificial layer (27) and the recesses (28). The conductive layer (32) serves as a shorting bar of a cantilever beam structure that couples input signal line (16) to output signal line (17) during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.