Patent · US Expired

Cable semiconductive shield compositions

US6706791B2 · kind B2 · utility

5Cited by
1References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 3, 2001
Grant dateMar 16, 2004
Priority date
Expiry dateJul 31, 2022

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/02
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A composition comprising:(a) one or more copolymers selected from the group consisting of (I) a copolymer of ethylene and vinyl acetate containing about 10 to about 50 percent by weight vinyl acetate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; (II) a copolymer of ethylene and ethyl acrylate containing about 10 to about 50 percent by weight ethyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes; and (III) a copolymer of ethylene and butyl acrylate containing about 10 to about 50 percent by weight butyl acrylate and having a melt mass flow rate of about 1 to about 100 grams per 10 minutes, and based upon 100 parts by weight of component (a):(b) about 55 to about 200 parts by weight of a linear copolymer of ethylene and an alpha-olefin having 3 to 12 carbon atoms, the copolymer having a melt mass flow rate of about 0.1 to about 30 grams per 10 minutes and a density of 0.870 to 0.944 gram per cubic centimeter;(c) about 5 to about 50 parts by weight of polypropylene having a melt mass flow rate of about 0.5 to about 30 grams per 10 minutes and a density of 0.900 to 0.920 gram per cubic centimeter;(d) about 2 to abo…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.