Plane splits filled with lossy materials
US6706974B2 · kind B2 · utility
20Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | May 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of reducing electromagnetic interference and improving signal quality in printed circuit boards with plane splits is described. The use of a lossy slot filling is described. The lossy filling is applied above plane splits and squeezed into the slots. The lossy material helps to damp antenna resonance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.