Semiconductor chip having an arrayed waveguide grating and module containing the semiconductor chip
US6707133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/29353
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
On a wafer, patterns of arrayed waveguide gratings are formed. Each arrayed waveguide grating has an arcuate shape obtained by arranging two curved-line portions convexed in the same direction at a predetermined spacing and connecting respective end portions thereof with two mutually parallel straight lines. These arrayed waveguide gratings are cut out along straight cutting paths and curved cutting paths in which two arcuate portions of the same shape are arranged side by side in a lateral direction. Thus, a larger number of chips can be produced as compared with a case where each array waveguide grating is cut out in a rectangular shape. Ultrasonic machining techniques or sandblast machining techniques are suitable for the cutting operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.