Sensor attachment structure for restricting sensor removal
US6708575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Mar 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a sensor attachment structure, a lead wire connecting a sensor is pinched in a pinch portion provided at a tip side portion of an extending bar, proximate to the sensor. The pinch portion has a protrusion that protrudes from the end surface of the pinch portion toward the sensor. A contact surface of the protrusion is inclined toward the sensor from a protruding direction of the pinch portion to have an inclination angle equal to or larger than a deflection angle that is formed at the tip side of the extending bar against the extending direction of the lead wire. Accordingly, even when a tensile force F is exerted to the lead wire opposite to the sensor side, a component force of the tensile force F along the contact surface becomes zero or is directed to the base of the pinch portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.