Heat sink module and an arrangment of heat sink modules
US6708757B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/13
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plate-like heat sink module with polygonal ground plan or shape has an upper side for securing a heat generating component and an underside comprises cooling ribs. The outside edges of the module have surface structure complementary with one another and with whose assistance a plurality of the identical heat sink modules can be joined in one plane, whereby the surface structures are fashioned so that a heat sink module can be joined to another heat sink module in only one orientation to form an arrangement of the heat sink modules. As a result of the arrangement of heat sink modules, a heat sink for the interconnection of a plurality of capacitors to form a capacitor bank can be produced in an especially flexible way.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.