Method for producing weld points on a substrate and guide for implementing said method
US6708868B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Oct 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0113
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for molding and soldering electrical connection pads to the electrical connection-receiving zones of electronic components or circuits includes an operation for the injection of conductive liquid alloy into a guide open at one end placed so as to face the connection-receiving zone of the component. The guide is formed by two separable parts, a mold and an injection matrix, the mold and the injection matrix including passages, with a narrowing of the guide at the level of the separation of the parts, and the parts of the guide are separated while the alloy is in the liquid state. Such a method may find particular application to, as an example, making connection pads for substrates or electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.