Orifice sealing physical barrier
US6708979B2 · kind B2 · utility
45Cited by
26References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/931
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
The present invention is a physical barrier for an orifice in a panel member which includes a plastic carrier and a patch adapted to adhere to said carrier and the panel member. The present invention also includes a method of sealing an orifice in a metal panel member with a plastic carrier. Lastly, the present invention includes a thermoplastic which adheres to both plastic and metal upon the application of heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.