Printed wiring board and semiconductor device and processes to prepare the same
US6709804B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Feb 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.