Light emitting diode and method of making the same
US6709883B2 · kind B2 · utility
22Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
Abstract
A light emitting diode (LED) and method of making the same are disclosed. The present invention uses a layer of elastic transparent adhesive material to bond a transparent substrate and a LED epitaxial structure having a light-absorbing substrate. The light absorbing substrate is then removed to form a LED having a transparent substrate. By the use of the transparent substrate, the light emitting efficiency of the LED can be significantly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.