Patent · US Expired

Crimped multicomponent filaments and spunbond webs made therefrom

US6709996B2 · kind B2 · utility

16Cited by
58References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 20, 2001
Grant dateMar 23, 2004
Priority date
Expiry dateFeb 23, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/681
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

Spunbond multicomponent filaments and nonwoven webs made from the filaments are disclosed. In accordance with the present invention, the multicomponent filaments contain a crimp enhancement additive. Specifically, the crimp enhancement additive is added to the polymeric component that has the slower solidification rate. The additive enhances crimp, allows for highly crimped filaments to be made at low fiber linear densities, improves the integrity of unbonded webs made from the filaments, and produces webs with improved stretch and cloth-like properties. The additive incorporated into the filaments is a random copolymer of butylene and propylene.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.