Thermal transfer sheet
US6710016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Apr 17, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/44
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal transfer sheet is provided which, during storage up to use thereof, is less likely to cause a dye contained in a thermally transferable ink layer to migrate to a heat-resistant protective layer in contact with the thermally transferable ink layer and, in actually performing thermal printing, does not cause heat fusing between a thermal head and the sheet. The thermal transfer sheet comprises: a substrate sheet; a thermally transferable ink layer provided on one surface of the substrate sheet; and provided on the other surface of the substrate sheet, a heat-resistant protective layer comprising a primer layer and a heat-resistant slip layer provided in that order, the primer layer being formed of a composition comprising a synthetic resin which has a storage modulus G′ of not less than 106 Pa at 40° C. and a loss modulus G″ of not less than 104 Pa at 120° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.