Curable epoxy resin composition comprising fillers

US6710105B1 · kind B1 · utility

Inventors

• Jens Awe · Weil am Rhein, DE
• Helmut Beer · Reichelsheim, DE
• Wilhelm Endlich · Munich, DE

Key dates

• Filing date: Jan 5, 1998
• Grant date: Mar 23, 2004
• Expiry date: Jan 5, 2018

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/36
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Curable epoxy resin compositions comprising(a) an epoxy resin having on average more than one epoxide group in the molecule,(b) an epoxy resin curing agent in an amount sufficient for full curing of the epoxy resin,(c) wollastonite having an average particle size of less than 100 &mgr;m in an amount of 10 to 350 parts by weight per 100 parts by weight of the sum of components (a) and (b),(d) a quartz/kaolinite mixture having an average particle size of less than 100 &mgr;m in an amount of 10 to 350 parts by weight per 100 parts by weight of the sum of components (a) and (b), the content of components (c) and (d) together not being greater than 360 parts by weight, and, if appropriate,(e) customary additives, are suitable for the production of mouldings having high-glass surfaces.