Laser machining device
US6710292B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Aug 5, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H2225/52
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention relates to a laser beam machining apparatus equipped with a spatial light modulator. The laser beam machining apparatus according to this invention comprises a reflection-type spatial light modulator, hologram pattern writing means for writing onto said reflection-type spatial light modulator a hologram pattern corresponding to the desired optical image intended to be irradiated onto a target, laser beam irradiating means for irradiating readout light onto said reflection-type spatial light modulator at an incidence angle &thgr;, and a Fourier lens for performing a Fourier transform of said readout light, phase modulated by said reflection-type spatial light modulator. Through use of this laser beam machining apparatus, improvement in utilization efficiency of the readout light and improvement in the level of freedom in machining patterns can be expected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.