Semiconductor device having a chip-size package
US6710437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Nov 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip having an edge and having a surface with a plurality of electrodes. A film is mounted over the surface of the semiconductor chip, the film has first and second surfaces and has a device hole. The first surface of the film is oriented toward the surface of the semiconductor chip and so that the device hole exposes the electrodes of the semiconductor chip. Connecting conductors are disposed at the first surface of the film and extend into the device hole to the electrodes. Electrode pad holes are provided in the film, at positions between the device hole and the edge of the semiconductor chip to expose the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.