Coil device
US6710694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Oct 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/0093
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil device includes a first magnetic substrate, a laminated body disposed on the first magnetic substrate and having insulating layers, coil patterns, and at least one through-hole, a magnetic layer covering the upper surface of the laminated body, an adhesive layer disposed on the magnetic layer, and a second magnetic substrate disposed on the adhesive layer and bonded to the magnetic layer via the adhesive layer. The insulating layers defining an insulator and the coil patterns for forming a coil are alternately stacked so that the coil patterns are arranged in the insulator, the through-hole is located at an area where the coils are not located and extends from the upper surface of the laminated body to the first magnetic substrate. The magnetic layer has at least one portion extending through the through-hole to contact the first magnetic substrate. The adhesive layer is nonmagnetic, and the laminated body is sandwiched between the first and second substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.