Patent · US Expired

Device and method for inspecting a three-dimensional surface structure

US6710867B2 · kind B2 · utility

2Cited by

5References

8Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hubert Bellm · Blankenloch, DE
Dieter Kant · Rheinstetten, DE

Key dates

Filing date	Mar 12, 2002
Grant date	Mar 23, 2004
Priority date	—
Expiry date	Mar 12, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3485
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An inspection device for inspecting the solder paste printing on printed circuit boards. Three-dimensional surface structures (19) are optically detected (7) and the values of their geometric properties are calculated. The values thus measured are inspected (29) for conformance to an absolute tolerance range. To fine-adjust the limit values, an operator has the option of evaluating the displayed defects as pseudo-defects, in which case the measured values are automatically accepted as the new limit values of the respective absolute tolerance range.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.