Integrated optoelectronic circuit and method of fabricating the same
US6711312B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.