Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
US6711812B1 · kind B1 · utility
26Cited by
25References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2000 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Apr 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.