Infrared data communication module and method of making the same
US6712529B2 · kind B2 · utility
19Cited by
12References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Dec 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An infrared data communication module (A) includes a substrate (1) having a surface (1a) for mounting a group (E) of components including a light emitting element (2), a light receiving element (3) and an IC element (4), and a molded body (5) formed of a molding resin to cover the entire surface (1a) of the substrate (1) for sealing the group (E) of components. The surface (1a) of the substrate (1) is formed with one or a plurality of jumper pads (11a, 11b) formed by plating a conductive film with gold. Each jumper pad (11a, 11b) is partially or entirely spaced from an edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.