Curable slurry for forming ceramic microstructures on a substrate using a mold
US6713526B2 · kind B2 · utility
4Cited by
31References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 24, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31612
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.