Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
US6713581B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
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Key dates
| Filing date | Jan 24, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F222/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.