Method and device for laser drilling laminates
US6713719B1 · kind B1 · utility
48Cited by
4References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Mar 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0195
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency≧30 kHz for the metal layer and ≧20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.