Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means
US6713844B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.