Low temperature co-fired ceramic-metal packaging technology
US6713862B2 · kind B2 · utility
34Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jul 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.