Micro electro-mechanical system method
US6714105B2 · kind B2 · utility
12Cited by
2References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2059/0054
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.