Thin film, method and apparatus for forming the same, and electronic component incorporating the same
US6714401B2 · kind B2 · utility
1Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2003 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Mar 4, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/85
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.