Substrate for power semiconductor modules with through-plating of solder and method for its production
US6715203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Feb 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for power semiconductor modules with a through-plating of solder, includes two metal plates and a ceramic plate which is seated as a layer between the metal plates and has a through hole formed therein. The substrate is plated through by making a through hole in one of the metal plates in alignment with the through hole in the ceramic plate and applying a paste solder to one side of the substrate. The substrate is then subjected to a furnace step, so that the paste solder flows into the through holes and the solder makes a permanent contact between the two metal plates. A method for producing the substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.