Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium
US6715871B2 · kind B2 · utility
47Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jun 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of forming a functional film pattern which allows the forming of fine film patterns with simplified steps. The present invention also provides a method of forming a functional film pattern where such defects as disconnection and short circuit rarely occurs, and forming a pattern which has a large thickness and is good for exhibiting a function such as electric conduction can be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.