Z-axis connection of multiple substrates by partial insertion of bulges of a pin
US6716038B2 · kind B2 · utility
11Cited by
30References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Sep 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1059
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A three-dimensional circuit module includes z-axis connection pins, such as twist pins to electrically connect multiple, spaced-apart substrates, such as circuit boards. An expanding portion of a bulge of the pin mechanically and electrically contacts a corner edge of a via in a substrate without full insertion of the bulge in the via. Compression of the expanding portion of the non-inserted bulge establishes the electrical connection, which is also assisted by the longitudinal restraint on the pin relative to the substrate. Assembly and disassembly is facilitated without requiring the bulge to be fully inserted into the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.